Writer: admin Time:2025-04-17 14:09:07 Browse:22℃
1. Material innovation: The application of new PCB materials has significantly improved recycling efficiency and environmental performance. For example, the Soluboard developed by Jiva Materials can decompose in hot water at 90 ℃, with a metal recovery rate of 90% and a carbon footprint reduction of 60%.
2. Process innovation: High density interconnect (HDI) technology increases wiring density by more than three times through micropores (<150 μ m) and layer addition processes, while reducing material consumption by 15%.
3. Intelligent manufacturing and quality control: AI technology empowers PCB design and production optimization. AI assisted design automatically optimizes the routing, stacking structure, and signal integrity of PCBs by analyzing historical data and design rules, significantly shortening the design cycle and reducing error rates. The machine vision system combined with AI can improve the accuracy and speed of PCB defect detection, reduce the dependence on manual quality inspection, and monitor production parameters in real time to quickly locate the root cause of problems and reduce scrap rates.
4. Environmental Protection and Sustainable Development: New technologies emphasize environmental protection and sustainable development. Using thinner copper foil and finer line width to achieve higher line density and faster signal transmission speed. Using environmentally friendly materials such as lead-free solder and water-based solder mask ink to reduce the impact on the environment. Maximizing resource utilization through optimizing production processes and recycling waste materials.
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