Double sided immersion gold FPC

Product parameters:

Plate thickness: 0.13mm

Solder mask: black film white character

Reinforcement: No reinforcement

Copper thickness: 0.5OZ

Production process: immersion gold process

Line width and spacing: ≥ 3mil

Material structure: double-sided tape+low loss yellow cover film+(line copper+adhesive+high-frequency dielectric polyimide substrate+adhesive+line copper)+low loss yellow cover film

Product Guarantee:

Structure diagram: